ETA-CU6SN5 PRECIPITATES IN CU/PB-SN SOLDER JOINTS

被引:11
作者
FELTON, LE [1 ]
RAJAN, K [1 ]
FICALORA, PJ [1 ]
SINGH, P [1 ]
机构
[1] IBM CORP,DIV DATA SYST,POUGHKEEPSIE,NY 12602
来源
SCRIPTA METALLURGICA ET MATERIALIA | 1991年 / 25卷 / 10期
关键词
D O I
10.1016/0956-716X(91)90024-U
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
[No abstract available]
引用
收藏
页码:2329 / 2333
页数:5
相关论文
共 3 条
[1]   THE EFFECT OF CU6SN5 WHISKER PRECIPITATES IN BULK 60SN-40PB SOLDER [J].
FREAR, D ;
GRIVAS, D ;
MORRIS, JW .
JOURNAL OF ELECTRONIC MATERIALS, 1987, 16 (03) :181-186
[2]   EFFECTS OF INTERMETALLIC FORMATION AT THE INTERFACE BETWEEN COPPER AND LEAD TIN SOLDER [J].
PARENT, JOG ;
CHUNG, DDL ;
BERNSTEIN, IM .
JOURNAL OF MATERIALS SCIENCE, 1988, 23 (07) :2564-2572
[3]  
QUAN L, 1987, J ELECTRON MATERS, V16, P204