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ETA-CU6SN5 PRECIPITATES IN CU/PB-SN SOLDER JOINTS
被引:11
作者
:
FELTON, LE
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,DIV DATA SYST,POUGHKEEPSIE,NY 12602
IBM CORP,DIV DATA SYST,POUGHKEEPSIE,NY 12602
FELTON, LE
[
1
]
RAJAN, K
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,DIV DATA SYST,POUGHKEEPSIE,NY 12602
IBM CORP,DIV DATA SYST,POUGHKEEPSIE,NY 12602
RAJAN, K
[
1
]
FICALORA, PJ
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,DIV DATA SYST,POUGHKEEPSIE,NY 12602
IBM CORP,DIV DATA SYST,POUGHKEEPSIE,NY 12602
FICALORA, PJ
[
1
]
SINGH, P
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,DIV DATA SYST,POUGHKEEPSIE,NY 12602
IBM CORP,DIV DATA SYST,POUGHKEEPSIE,NY 12602
SINGH, P
[
1
]
机构
:
[1]
IBM CORP,DIV DATA SYST,POUGHKEEPSIE,NY 12602
来源
:
SCRIPTA METALLURGICA ET MATERIALIA
|
1991年
/ 25卷
/ 10期
关键词
:
D O I
:
10.1016/0956-716X(91)90024-U
中图分类号
:
T [工业技术];
学科分类号
:
08 ;
摘要
:
[No abstract available]
引用
收藏
页码:2329 / 2333
页数:5
相关论文
共 3 条
[1]
THE EFFECT OF CU6SN5 WHISKER PRECIPITATES IN BULK 60SN-40PB SOLDER
[J].
FREAR, D
论文数:
0
引用数:
0
h-index:
0
机构:
Lawrence Berkeley Lab, Berkeley, CA,, USA, Lawrence Berkeley Lab, Berkeley, CA, USA
FREAR, D
;
GRIVAS, D
论文数:
0
引用数:
0
h-index:
0
机构:
Lawrence Berkeley Lab, Berkeley, CA,, USA, Lawrence Berkeley Lab, Berkeley, CA, USA
GRIVAS, D
;
MORRIS, JW
论文数:
0
引用数:
0
h-index:
0
机构:
Lawrence Berkeley Lab, Berkeley, CA,, USA, Lawrence Berkeley Lab, Berkeley, CA, USA
MORRIS, JW
.
JOURNAL OF ELECTRONIC MATERIALS,
1987,
16
(03)
:181
-186
[2]
EFFECTS OF INTERMETALLIC FORMATION AT THE INTERFACE BETWEEN COPPER AND LEAD TIN SOLDER
[J].
PARENT, JOG
论文数:
0
引用数:
0
h-index:
0
机构:
Carnegie Mellon Univ, United States
PARENT, JOG
;
CHUNG, DDL
论文数:
0
引用数:
0
h-index:
0
机构:
Carnegie Mellon Univ, United States
CHUNG, DDL
;
BERNSTEIN, IM
论文数:
0
引用数:
0
h-index:
0
机构:
Carnegie Mellon Univ, United States
BERNSTEIN, IM
.
JOURNAL OF MATERIALS SCIENCE,
1988,
23
(07)
:2564
-2572
[3]
QUAN L, 1987, J ELECTRON MATERS, V16, P204
←
1
→
共 3 条
[1]
THE EFFECT OF CU6SN5 WHISKER PRECIPITATES IN BULK 60SN-40PB SOLDER
[J].
FREAR, D
论文数:
0
引用数:
0
h-index:
0
机构:
Lawrence Berkeley Lab, Berkeley, CA,, USA, Lawrence Berkeley Lab, Berkeley, CA, USA
FREAR, D
;
GRIVAS, D
论文数:
0
引用数:
0
h-index:
0
机构:
Lawrence Berkeley Lab, Berkeley, CA,, USA, Lawrence Berkeley Lab, Berkeley, CA, USA
GRIVAS, D
;
MORRIS, JW
论文数:
0
引用数:
0
h-index:
0
机构:
Lawrence Berkeley Lab, Berkeley, CA,, USA, Lawrence Berkeley Lab, Berkeley, CA, USA
MORRIS, JW
.
JOURNAL OF ELECTRONIC MATERIALS,
1987,
16
(03)
:181
-186
[2]
EFFECTS OF INTERMETALLIC FORMATION AT THE INTERFACE BETWEEN COPPER AND LEAD TIN SOLDER
[J].
PARENT, JOG
论文数:
0
引用数:
0
h-index:
0
机构:
Carnegie Mellon Univ, United States
PARENT, JOG
;
CHUNG, DDL
论文数:
0
引用数:
0
h-index:
0
机构:
Carnegie Mellon Univ, United States
CHUNG, DDL
;
BERNSTEIN, IM
论文数:
0
引用数:
0
h-index:
0
机构:
Carnegie Mellon Univ, United States
BERNSTEIN, IM
.
JOURNAL OF MATERIALS SCIENCE,
1988,
23
(07)
:2564
-2572
[3]
QUAN L, 1987, J ELECTRON MATERS, V16, P204
←
1
→