THRESHOLD CURRENT-DENSITY AND INCUBATION-TIME TO ELECTROMIGRATION IN GOLD-FILMS

被引：46

作者：

KINSBRON, E ^{[1
]}

BLECH, IA ^{[1
]}

KOMEM, Y ^{[1
]}

机构：

[1] ISRAEL INST TECHNOL,DEPT MAT ENGN TECH,HAIFA 32000,ISRAEL

来源：

THIN SOLID FILMS | 1977年 / 46卷 / 02期

关键词：

D O I：

10.1016/0040-6090(77)90056-6

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：139 / 150

页数：12

共 15 条

[1] ELECTROMIGRATION-INDUCED FAILURES IN, AND MICROSTRUCTURE AND RESISTIVITY OF, SPUTTERED GOLD FILMS [J].

BLAIR, JC ;

GHATE, PB ;

FULLER, CR ;

HAYWOOD, CT .

JOURNAL OF APPLIED PHYSICS, 1972, 43 (02) :307-&

[2] ELECTROMIGRATION IN THIN GOLD-FILMS ON MOLYBDENUM SURFACES [J].

BLECH, IA ;

KINSBRON, E .

THIN SOLID FILMS, 1975, 25 (02) :327-334

[3] STRESS GENERATION BY ELECTROMIGRATION [J].

BLECH, IA ;

HERRING, C .

APPLIED PHYSICS LETTERS, 1976, 29 (03) :131-133

[4] ELECTROMIGRATION IN THIN ALUMINUM FILMS ON TITANIUM NITRIDE [J].

BLECH, IA .

JOURNAL OF APPLIED PHYSICS, 1976, 47 (04) :1203-1208

[5] ELECTROMIGRATION AND CREVICE FORMATION IN THIN METALLIC FILMS [J].

BLECH, IA .

THIN SOLID FILMS, 1972, 13 (01) :117-&

[6] ELECTROMIGRATION AND FAILURE IN ELECTRONICS - INTRODUCTION [J].

DHEURLE, FM .

PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, 1971, 59 (10) :1409-&

[7] ELECTROMIGRATION OF TI-AU THIN-FILM CONDUCTORS AT 180-DEGREES C [J].

ENGLISH, AT ;

TAI, KL ;

TURNER, PA .

JOURNAL OF APPLIED PHYSICS, 1974, 45 (09) :3757-3767

[8] STUDY OF CONDUCTIVE GOLD FILM LIFETIME UNDER HIGH-CURRENT DENSITIES [J].

ETZION, M ;

BLECH, IA ;

KOMEM, Y .

JOURNAL OF APPLIED PHYSICS, 1975, 46 (04) :1455-1458

[9] ACTIVATION-ENERGY FOR ELECTROMIGRATION AND GRAIN-BOUNDARY SELF-DIFFUSION IN GOLD [J].

GANGULEE, A ;

DHEURLE, FM .

SCRIPTA METALLURGICA, 1973, 7 (10) :1027-1030

[10] DIRECT MEASUREMENT OF DIFFUSION AT TEMPERATURES LESS THAN 0.5 TM [J].

GUPTA, D .

THIN SOLID FILMS, 1975, 25 (01) :231-244

← 1 2 →