THICK-FILM GLASS-CERAMIC CAPACITORS

被引：0
|
作者：
BIGGERS, JV
MARSHALL, GL
STRICKLER, DW
机构：
来源：
SOLID STATE TECHNOLOGY | 1970年 / 13卷 / 05期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：63 / +
页数：1
相关论文
共 50 条
  • [1] THICK-FILM GLASS-CERAMIC CAPACITORS
    BIGGERS, JV
    STRICKLER, DW
    MARSHALL, GL
    AMERICAN CERAMIC SOCIETY BULLETIN, 1968, 47 (04): : 393 - +
  • [2] GLASS-CERAMIC INTERACTIONS AND THICK-FILM METALLIZATION OF ALUMINUM NITRIDE
    NORTON, MG
    JOURNAL OF MATERIALS SCIENCE, 1991, 26 (09) : 2322 - 2328
  • [3] THICK-FILM TERMINATIONS FOR MULTILAYER CERAMIC CAPACITORS
    BURKE, DP
    STUPAK, RE
    AMERICAN CERAMIC SOCIETY BULLETIN, 1982, 61 (08): : 815 - 815
  • [4] Investigation of sensing performances of thick-film resistors sintered on fluorophlogopite glass-ceramic substrates
    Wen, Ming
    Guan, Xinchun
    SENSORS AND ACTUATORS A-PHYSICAL, 2024, 370
  • [5] ADHESION STRENGTH OF THICK-FILM PLATINUM CONDUCTORS ON GLASS-CERAMIC NITRIDE AND OXIDE CERAMICS
    CHEN, KC
    FU, SL
    MACKENZIE, JD
    AMERICAN CERAMIC SOCIETY BULLETIN, 1981, 60 (09): : 932 - 932
  • [6] Embedding ceramic thick-film capacitors into printed wiring boards
    Borland, W
    Doyle, M
    Dellis, L
    Renovales, O
    Majumdar, D
    Materials, Integration and Packaging Issues for High-Frequency Devices II, 2005, 833 : 143 - 151
  • [7] GLASS-PASSIVATED THICK-FILM CAPACITORS FOR RC CIRCUITS
    BRATSCHUN, WR
    IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1976, 12 (03): : 194 - 201
  • [8] THICK-FILM CHIP CAPACITORS
    AMIN, RB
    BACHER, RJ
    MCGONNELL, JP
    AMERICAN CERAMIC SOCIETY BULLETIN, 1972, 51 (04): : 355 - +
  • [9] PRINTED THICK-FILM CAPACITORS
    ISERT, H
    F&M-FEINWERKTECHNIK & MESSTECHNIK, 1975, 83 (04): : 173 - 178
  • [10] LOW FREQUENCY DISPERSION IN THICK-FILM CAPACITORS WITH RUTILE-GLASS INSULATION.
    Licznerski, Benedykt
    Nitsch, Karol
    Rzasa, Benedykt
    Archiwum Elektrotechniki (Warsaw), 1977, 26 (04): : 743 - 767
12345