AN ELECTROCHEMICAL DEPOSITION PROCESS FOR THE SYNTHESIS OF LAMINATED NANOCOMPOSITES

被引:7
作者
HASEEB, ASMA
CELIS, JP
ROOS, JR
机构
[1] BANGLADESH UNIV ENGN & TECHNOL,DEPT MET ENGN,DHAKA 1000,BANGLADESH
[2] KATHOLIEKE UNIV LEUVEN,DEPT MAT & MET ENGN,B-3001 HEVERLEE,BELGIUM
关键词
D O I
10.1080/10426919508935061
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
There has recently been a growing trend towards controlling the microstructure of materials at the nanometer level. Such ultrafine microstructure can provide unusual and interesting properties not attainable in conventional materials. This work describes an automated setup for the electrochemical deposition of laminated composites consisting of alternate layers of two different materials with individual laminate thickness in the range of nanometers. The setup uses two impinging electrolyte jets for deposition. In order to limit the mutual contamination of the baths, a novel gas curtain system has been employed. Characterization by Auger electron spectroscopy depth profiling and scanning electron microscopy has shown that the process can produce laminated nanocomposites with uniform structure and thickness. Under the proper deposition conditions no structural defects like islands or delamination could be found. The study thus demonstrates the capability of the relatively inexpensive electrochemical deposition process for the production of advanced materials with ultrafine microstructure.
引用
收藏
页码:707 / 716
页数:10
相关论文
共 12 条
[1]  
Bauer E., 1958, Z KRISTALLOGR, V110, P372, DOI DOI 10.1524/ZKRI.1958.110.1-6.372
[2]  
CHIN DT, 1978, J ELECTROCHEMICAL SO, V135, P1461
[3]  
DHEZ P, 1987, NATO ASI SERIES
[4]  
HASEEB A, 1992, T MET FINISH INDIA, V1, P15
[5]  
HASEEB ASM, 1992, THESIS U LEUVEN BELG
[6]   DUAL-BATH ELECTRODEPOSITION OF CU/NI COMPOSITIONALLY MODULATED MULTILAYERS [J].
HASEEB, ASMA ;
CELIS, JP ;
ROOS, JR .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1994, 141 (01) :230-237
[7]   DEPTH RESOLUTION AND SURFACE-ROUGHNESS EFFECTS IN SPUTTER PROFILING OF NICR MULTILAYER SANDWICH SAMPLES USING AUGER-ELECTRON SPECTROSCOPY [J].
HOFMANN, S ;
ERLEWEIN, J ;
ZALAR, A .
THIN SOLID FILMS, 1977, 43 (03) :275-283
[8]  
HONG M, 1988, METALLIC MULTILAYER
[9]   ACCOMMODATION OF MISFIT BETWEEN SINGLE-CRYSTAL FILMS OF NICKEL AND COPPER [J].
MATTHEWS, JW ;
CRAWFORD, JL .
THIN SOLID FILMS, 1970, 5 (03) :187-&
[10]   INITIAL STAGES OF ELECTROMONOCRYSTALLIZATION OF NICKEL ON COPPER-FILM SUBSTRATES [J].
NAKAHARA, S ;
WEIL, R .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1973, 120 (11) :1462-1469