AUTOMATED VISUAL INSPECTION OF SOLDER PASTE DEPOSITION ON SURFACE MOUNT TECHNOLOGY PCBS

被引：2
|
作者：
MAHON, J [1 ]
HARRIS, N [1 ]
VERNON, D [1 ]
机构：
[1] UNIV DUBLIN TRINITY COLL,DEPT COMP SCI,DUBLIN 2,IRELAND
来源：
COMPUTERS IN INDUSTRY | 1989年 / 12卷 / 01期
关键词：
D O I：
10.1016/0166-3615(89)90029-8
中图分类号：
TP39 [计算机的应用];
学科分类号：
081203 ; 0835 ;
摘要：
引用
收藏
页码：31 / 42
页数：12
相关论文
共 50 条
  • [41] D3PointNet: Dual-Level Defect Detection PointNet for Solder Paste Printer in Surface Mount Technology
    Park, Jin-Man
    Yoo, Yong-Ho
    Kim, Ue-Hwan
    Lee, Dukyoung
    Kim, Jong-Hwan
    IEEE ACCESS, 2020, 8 (08) : 140310 - 140322
  • [42] Thermal profiling to overcome flux residue formation in a no-clean solder paste for lead-free surface mount technology
    Buenaflor, Leah
    Dal, Sheila Liza
    Estinozo, Ian
    ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 338 - 341
  • [43] SOLDER JOINT RELIABILITY OF FINE PITCH SURFACE MOUNT TECHNOLOGY ASSEMBLIES
    LAU, J
    POWERS, L
    BAKER, J
    RICE, D
    SHAW, B
    SEVENTH IEEE/CHMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM: INTEGRATION OF THE MANUFACTURING FLOW - FROM RAW MATERIAL THROUGH SYSTEMS-LEVEL ASSEMBLY, 1989, : 48 - 60
  • [44] SOLDER JOINT RELIABILITY OF FINE PITCH SURFACE MOUNT TECHNOLOGY ASSEMBLIES
    LAU, J
    POWERSMALONEY, LM
    BAKER, JR
    RICE, D
    SHAW, B
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (03): : 534 - 544
  • [45] Advancing surface mount technology quality: a computer-assisted approach for enhanced X-ray inspection of solder joints
    Nathália Mattos Terra
    Sandro Breval Santiago
    Adalena Kennedy Vieira
    Raimundo Kennedy Vieira
    The International Journal of Advanced Manufacturing Technology, 2024, 131 : 5897 - 5904
  • [46] Advancing surface mount technology quality: a computer-assisted approach for enhanced X-ray inspection of solder joints
    Terra, Nathalia Mattos
    Santiago, Sandro Breval
    Vieira, Adalena Kennedy
    Vieira, Raimundo Kennedy
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2024, 131 (12): : 5897 - 5904
  • [47] Integrating the Taguchi method and the multiattribute decision-making method to optimize the surface mount technology solder paste printing thickness process
    Wang, Shen-Tsu
    PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE, 2013, 227 (08) : 1209 - 1217
  • [48] DIFFERENTIAL SCANNING CALORIMETRY STUDIES ON EUTECTIC (SN63/PB37) SOLDER PASTE AND POWDER FOR SURFACE MOUNT TECHNOLOGY
    TANG, ACT
    SARGENT, PM
    ELECTRONICS LETTERS, 1991, 27 (22) : 2018 - 2020
  • [49] A comparison of lifted lead defect inspection system for surface mount technology
    Ramli, Rizauddin
    Wahab, Dzuraidah Abd
    Ghani, Jaharah Abd
    Zain, Raime M.
    JOURNAL OF SCIENTIFIC & INDUSTRIAL RESEARCH, 2012, 71 (05): : 330 - 333
  • [50] Automated optical inspection system for surface mount device light emitting diodes
    Chung-Feng Jeffrey Kuo
    Tz-ying Fang
    Chi-Lung Lee
    Han-Cheng Wu
    Journal of Intelligent Manufacturing, 2019, 30 : 641 - 655
12345