OPTIMIZATION OF ALIGNABILITY IN INTEGRATED PLANAR-OPTICAL INTERCONNECT PACKAGES

被引：13

作者：

BEECH, RS

GHOSH, AK

机构：

[1] Department of Electrical and Computer Engineering, University of Iowa, Iowa, IA

来源：

APPLIED OPTICS | 1993年 / 32卷 / 29期

关键词：

OPTICAL INTERCONNECTS; OPTICAL PACKAGING; INTEGRATED PLANAR OPTICS; OPTICAL ALIGNMENT;

D O I：

10.1364/AO.32.005741

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

The efficiency of power transfer and the alignability of an integrated planar-optics holographic optical backplane for board-to-board interconnections are analyzed. Both the efficiency and the alignability are functions of lateral and angular offsets in the input, the error in the spatial frequency of the hologram, errors in the source wavelength, the distance between two boards, the thickness of the substrate, the sizes of the hologram and the beam spot, and the angle of propagation of the beam. From the analyses, design guidelines on integrated planar-optic interconnects are developed, and it is shown that the interconnect design can be optimized for maximum alignability. A design with optimum alignability may not have the highest possible peak efficiency, but it can tolerate greater offsets without a substantial efficiency decrease.

引用

页码：5741 / 5749

页数：9

共 13 条

[1] INTEGRATED-OPTICAL ARRAY GENERATOR [J].