A PLANARIZATION TECHNOLOGY USING A BIAS-DEPOSITED DIELECTRIC FILM AND AN ETCH-BACK PROCESS

被引：7
作者：
FUJII, S
FUKUMOTO, M
FUSE, G
OHZONE, T
机构：
来源：
IEEE TRANSACTIONS ON ELECTRON DEVICES | 1988年 / 35卷 / 11期
关键词：
D O I：
10.1109/16.7393
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：1829 / 1833
页数：5
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