共 50 条
[42]
DIFFUSIONAL BREAKDOWN OF A AG DIFFUSION BARRIER IN A CU-AG-NI DIFFUSION TRIPLE
[J].
METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE,
1986, 17 (06)
:933-944
[44]
Recent advances in the solvent extraction of Cu, Ni, Co
[J].
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY,
2003, 55 (07)
:A23-A23
[46]
TEM investigation of interfacial microstructure and fracture mode of the Sn-Ag-Cu/Ni joint system
[J].
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,
2017, 706
:269-278
[47]
Primary solidification phases of the Sn-rich Sn-Ag-Cu-Ni quaternary system
[J].
Journal of Electronic Materials,
2005, 34
:1135-1142
[48]
Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the sn-rich corner
[J].
Journal of Electronic Materials,
2004, 33
:1071-1079
[50]
Thermodynamic calculation of phase equilibria and its applications in the Sn-Ag-Cu-Ni-Au system
[J].
ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS,
2007,
:324-+