MECHANICAL-PROPERTIES OF COPPER-FILMS

被引：1

作者：

CHOURASIA, NC

KALKUNDRI, SB

GADGEEL, VL

机构：

[1] Metallurgical Engineering Department, Faculty of Technology and Engineering, Maharaja Sayajirao University of Baroda, Vadodara, 390001

来源：

CRYSTAL RESEARCH AND TECHNOLOGY | 1993年 / 28卷 / 04期

关键词：

D O I：

10.1002/crat.2170280422

中图分类号：

O7 [晶体学];

学科分类号：

0702 ; 070205 ; 0703 ; 080501 ;

摘要：

Mechanical properties of vacuum-deposited copper films have been studied on various well cleaned and polished substrates. The density reaches the bulk value for a film thickness of 4 mum and above. The strain developed during the growth of film was found to be tensile and is dependent on nature of the substrate. The adhesion of film was observed to be thickness - and time of ageing dependent. The results are discussed.

引用

页码：539 / 542

页数：4

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