SOFT-X-RAY PROJECTION LITHOGRAPHY

被引：0

作者：

WHITE, DL ^{[1
]}

BJORKHOLM, JE ^{[1
]}

BOKOR, J ^{[1
]}

EICHNER, L ^{[1
]}

FREEMAN, RR ^{[1
]}

JEWELL, TE ^{[1
]}

MANSFIELD, WM ^{[1
]}

MACDOWELL, AA ^{[1
]}

SZETO, LH ^{[1
]}

TAYLOR, DW ^{[1
]}

TENNANT, DM ^{[1
]}

WASKIEWICZ, WK ^{[1
]}

WINDT, DL ^{[1
]}

WOOD, OR ^{[1
]}

机构：

[1] AT&T BELL LABS,HOLMDEL,NJ 07733

来源：

SOLID STATE TECHNOLOGY | 1991年 / 34卷 / 07期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This article examines soft x-ray projection lithography (SXPL) as a potential late 1990's technology for the mass production of ICs with 0.1-mu-m features. Synchrotron radiation and laser generated plasma x-ray sources may both be suitable for volume production. Reflecting optics are required for projection lithography in the 13 to 16 nm range. Building a projection camera will require advances in mirror blank fabrication, multilayer film techniques for high reflectivity coatings, x-ray metrology, and alignment systems.

引用

页码：37 / 42

页数：6

共 22 条

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