BEAM LEADS VS FLIP-CHIPS .2.

被引：0
|
作者：
SEGALLIS, B
机构：
来源：
ELECTRONIC PRODUCTS MAGAZINE | 1969年 / 11卷 / 12期
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D O I：
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：10 / +
页数：1
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