TEMPERATURE CYCLING OF HIC THIN-FILM SOLDER CONNECTIONS

被引：12
作者：
KELLER, HN
机构：
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1981年 / 4卷 / 01期
关键词：
D O I：
10.1109/TCHMT.1981.1135767
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：132 / 139
页数：8
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