MICRO-CORROSION OF AL-CU BONDING PADS

被引：28

作者：

THOMAS, S

BERG, HM

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 02期

关键词：

D O I：

10.1109/TCHMT.1987.1134741

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：252 / 257

页数：6

共 15 条

[1] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J].

AMES, I ;

DHEURLE, FM ;

HORSTMANN, RE .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) :461-+

[2]

BERG HM, 1985, P EL COMP C, P98

[3]

Binger W. W., 1967, ALUMINUM, VI

[4]

Black, 1971, 9 ANN P REL PHYS IEE, P120

[5]

DENNISON DR, 1979, 7902 PERK TECH REP

[6] EFFECT OF COPPER ADDITIONS ON ELECTROMIGRATION IN ALUMINUM THIN FILMS [J].

DHEURLE, FM .

METALLURGICAL TRANSACTIONS, 1971, 2 (03) :683-&

[7] THE CHEMICAL NATURE OF ALUMINUM CORROSION .5. ENERGY-TRANSFER IN ALUMINUM DISSOLUTION [J].

FOLEY, RT ;

NGUYEN, TH .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (03) :464-467

[8] HILLOCK GROWTH ON VACUUM-DEPOSITED ALUMINUM FILMS [J].

HERMAN, DS ;

SCHUSTER, MA ;

GERBER, RM .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01) :515-&

[9]

Kehl G.L, 1949, PRINCIPLES METALLOGR

[10] EVOLUTION AND CURRENT STATUS OF ALUMINUM METALLIZATION [J].

LEARN, AJ .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1976, 123 (06) :894-906

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