MICRO-CORROSION OF AL-CU BONDING PADS

[1] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) : 461 - +

[2] BERG HM, 1985, P EL COMP C, P98

[3] Binger W. W., 1967, ALUMINUM, VI

[4] Black, 1971, 9 ANN P REL PHYS IEE, P120

[5] DENNISON DR, 1979, 7902 PERK TECH REP

[6] EFFECT OF COPPER ADDITIONS ON ELECTROMIGRATION IN ALUMINUM THIN FILMS [J]. METALLURGICAL TRANSACTIONS, 1971, 2 (03): : 683 - &

[7] THE CHEMICAL NATURE OF ALUMINUM CORROSION .5. ENERGY-TRANSFER IN ALUMINUM DISSOLUTION [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (03) : 464 - 467

[8] HILLOCK GROWTH ON VACUUM-DEPOSITED ALUMINUM FILMS [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01): : 515 - &

[9] Kehl G.L, 1949, PRINCIPLES METALLOGR

[10] EVOLUTION AND CURRENT STATUS OF ALUMINUM METALLIZATION [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1976, 123 (06) : 894 - 906

[1] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) : 461 - +

[2] BERG HM, 1985, P EL COMP C, P98

[3] Binger W. W., 1967, ALUMINUM, VI

[4] Black, 1971, 9 ANN P REL PHYS IEE, P120

[5] DENNISON DR, 1979, 7902 PERK TECH REP

[6] EFFECT OF COPPER ADDITIONS ON ELECTROMIGRATION IN ALUMINUM THIN FILMS [J]. METALLURGICAL TRANSACTIONS, 1971, 2 (03): : 683 - &

[7] THE CHEMICAL NATURE OF ALUMINUM CORROSION .5. ENERGY-TRANSFER IN ALUMINUM DISSOLUTION [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (03) : 464 - 467

[8] HILLOCK GROWTH ON VACUUM-DEPOSITED ALUMINUM FILMS [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01): : 515 - &

[9] Kehl G.L, 1949, PRINCIPLES METALLOGR

[10] EVOLUTION AND CURRENT STATUS OF ALUMINUM METALLIZATION [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1976, 123 (06) : 894 - 906