The evolution of IBM high performance cooling technology

被引：16

作者：

Simons, RE

机构：

[1] independent consultant in Poughkeepsie

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1995年 / 18卷 / 04期

关键词：

thermal management; air cooling; water cooling; heat sinks; thermal conduction module; liquid encapsulated module; turbulators; liquid immersion; impingement cooling;

D O I：

10.1109/95.477467

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper provides a perspective and review of the evolution of high performance cooling technology that has been developed and used in IBM medium and large-scale computers over the past 25 years, Package cooling technology and its evolution, leading to the development of the thermal conduction module (TCM) is described, The development of air cooling technology is discussed; along with enhancements using turbulators, air-to-liquid heat exchangers, and impinging how, The development of water cooling and direct liquid immersion technology is also covered.

引用

页码：805 / 811

页数：7

共 17 条

[1]

AAKALU NG, 1973, Patent No. 3741292

[2]

ANTONETTI VW, 1971, ASHRAE JOURNAL, V13, P25

[3]

ANTONETTI VW, 1967, 8TH INT EL CIRC PACK

[4]

ANTONETTI VW, 1973, ELECTRO MECHANIC SEP, P34

[5]

Bergles A. E., 1986, ASME HTD, V57, P1

[6]

CHRYSLER GM, 1994, 4TH P INT C THERM PH

[7]

CHU RC, 1994, NATO ADV SCI INST SE, V258, P71

[8] CONDUCTION COOLING FOR AN LSI PACKAGE - A ONE-DIMENSIONAL APPROACH [J].

CHU, RC ;

HWANG, UP ;

SIMONS, RE .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) :45-54

[9]

CHU RC, 1971, Patent No. 3586101

[10] DUAL-TAPERED-PISTON (DTP) MODULE COOLING FOR IBM ENTERPRISE SYSTEM/9000 SYSTEMS [J].

GOTH, GF ;

ZUMBRUNNEN, ML ;

MORAN, KP .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1992, 36 (04) :805-816

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