INTERFACIAL STRESSES IN A MICROBOND PULL-OUT SPECIMEN

被引：0

作者：

VENKATAKRISHNAIAH, S ^{[1
]}

DHARANI, LR ^{[1
]}

机构：

[1] UNIV MISSOURI,DEPT MECH & AEROSP ENGN & ENGN MECH,ROLLA,MO 65401

来源：

EUROPEAN JOURNAL OF MECHANICS A-SOLIDS | 1994年 / 13卷 / 03期

关键词：

D O I：

暂无

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

A consistent shear-lag model in cylindrical co-ordinates is used to solve for the interfacial stresses in a microbond Pull-out test specimen. The test specimen is modelled as an assembly of concentric cylinders and a perfect bonding is assumed at the fiber/matrix interface. The governing equations are solved using an eigen value technique. A parametric study is done for various fiber embedded lengths, fiber diameters, matrix elastic properties and specimen support geometries.

引用

页码：311 / 325

页数：15

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