HILLOCK GROWTH IN THIN-FILMS

被引：185

作者：

CHAUDHAR.P ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

关键词：

D O I：

10.1063/1.1663054

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：4339 / 4346

页数：8

共 15 条

[1]

CARSLAW HS, 1950, CONDUCTION HEAT SOLI, P272

[2] LOW-TEMPERATURE PROPERTIES OF EVAPORATED LEAD FILMS [J].

CASWELL, HL ;

PRIEST, JR ;

BUDO, Y .

[3] GRAIN-GROWTH AND STRESS RELIEF IN THIN-FILMS [J].

CHAUDHAR.P .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01) :520-&

[4] MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS [J].

CHAUDHARI, P .

[5]

CHAUDHARI P, 1967, J VAC SCI TECHNOL, V6, P618

[6]

Chirvinskii P. N., 1948, METEORITIKA, P75

[7] STRAIN-RELAXATION IN THIN-FILMS ON SUBSTRATES [J].

GANGULEE, A .

ACTA METALLURGICA, 1974, 22 (02) :177-183

[8]

GANGULEE A, PRIVATE COMMUNICATIO

[9] DIFFUSIONAL VISCOSITY OF A POLYCRYSTALLINE SOLID [J].

HERRING, C .

[10]

HILDEBRAND FB, 1962, ADV CALCULUS APPLICA, P535