Microelectronic adhesives have been investigated to determine volatile and adsorbed species that evolve during cure and after postcure processing, such as extended heating (as in burn-in tests). Stable volatile species were measured using mass spectrometric methods. Some of these volatile species interact strongly with surfaces and remain adsorbed. Other, non-volatile, species are transported from the bulk adhesive via surface diffusion. The adsorbed species were measured using Auger electron spectroscopy and X-ray photoelectron spectroscopy. The effect of UV/ozone and argon plasma in removing these adsorbed species was investigated. And, after cleaning, the effect of extended heating on adsorbed species from cured adhesives was studied.