INCREASE IN THE ELECTRICAL-RESISTANCE OF HEAT-TREATED EU/AL FILMS

被引：0

作者：

DAKHEL, AA

机构：

[1] Al-Salmani Post Office

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 1993年 / 202卷

关键词：

D O I：

10.1016/0925-8388(93)90501-D

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

[No abstract available]

引用

页码：L5 / L6

页数：2

共 8 条

[1] SPECIAL ASPECTS OF DIFFUSION IN THIN-FILMS [J].

BALLUFFI, RW ;

BLAKELY, JM .

THIN SOLID FILMS, 1975, 25 (02) :363-392

[2] DIFFUSION MECHANISMS IN PD-AU THIN-FILM SYSTEM AND CORRELATION OF RESISTIVITY CHANGES WITH AUGER-ELECTRON SPECTROSCOPY AND RUTHERFORD BACKSCATTERING PROFILES [J].

HALL, PM ;

MORABITO, JM ;

POATE, JM .

THIN SOLID FILMS, 1976, 33 (01) :107-134

[3] CHEMICAL CHARACTERIZATION OF COATINGS BY ANALYTICAL TECHNIQUES SENSITIVE TO SURFACE AND NEAR-SURFACE [J].

HOLLOWAY, PH ;

MCGUIRE, GE .

THIN SOLID FILMS, 1978, 53 (01) :3-18

[4] MECHANISMS OF INTERDIFFUSION IN COPPER NICKEL THIN-FILM COUPLES [J].

JOHNSON, BC ;

BAUER, CL ;

JORDAN, AG .

JOURNAL OF APPLIED PHYSICS, 1986, 59 (04) :1147-1155

[5] THE INCREASE IN THE ELECTRICAL-RESISTANCE OF HEAT-TREATED AU-CR FILMS [J].

MUNITZ, A ;

KOMEM, Y .

THIN SOLID FILMS, 1980, 71 (02) :177-188

[6]

Poate J M, 1978, THIN FILMS INTERDIFF

[7] INVESTIGATION OF INTERFACIAL REACTIONS IN MONO-CRYSTALLINE AND POLYCRYSTALLINE THIN-FILM COUPLES OF GOLD AND SILVER BY AUGER DEPTH PROFILING, TRANSMISSION ELECTRON-MICROSCOPY AND MEASUREMENT OF CONTACT RESISTANCE [J].

SEN, SK ;

KLUGEWEISS, PM ;

BAUER, CL .

THIN SOLID FILMS, 1981, 82 (04) :299-311

[8] INVESTIGATION OF INTERFACIAL REACTIONS IN BIMETALLIC THIN-FILM COUPLES OF AL/CU AND PB/CU BY MEASUREMENT OF CONTACT RESISTANCE [J].

SHEARER, MP ;

SEN, SK ;

BAUER, CL .

PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1982, 69 (01) :139-149

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