THICKNESS AND DIFFUSION STUDIES OF PLATED GOLD-CDA 725 (CU 89 WT PERCENT-NI 9 WT PERCENT-SN 2 WT PERCENT) ALLOY SYSTEM

被引：0

作者：

HAQUE, CA

FUCHS, HE

机构：

[1] BELL TEL LABS INC,COLUMBUS,OH 43213

[2] WESTERN ELECT CORP,KANSAS CITY WORKS,KANSAS CITY,MO

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1977年 / 14卷 / 01期

关键词：

D O I：

10.1116/1.569128

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：231 / 231

页数：1

共 49 条

[31] A HIGH-RESOLUTION TRANSMISSION ELECTRON-MICROSCOPY INVESTIGATION OF THE DELTA'-THETA-' PRECIPITATE STRUCTURE IN AN AL-2WT-PERCENT LI-1 WT-PERCENT CU ALLOY [J].

HOWE, JM ;

LAUGHLIN, DE ;

VASUDEVAN, AK .

PHILOSOPHICAL MAGAZINE A-PHYSICS OF CONDENSED MATTER STRUCTURE DEFECTS AND MECHANICAL PROPERTIES, 1988, 57 (06) :955-969

[32] THE VARIATION OF WORK-HARDENING CHARACTERISTICS OF CD-2 WT-PERCENT SN ALLOY DURING TRANSFORMATION [J].

MOSTAFA, MM ;

ALGANAINY, GS ;

SAKR, MS .

PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1995, 150 (02) :715-721

[33] STUDY OF HIGH COPPER AMALGAMS .2. AMALGAMATION ON A HG-PLATED HIGH COPPER ALLOY CONTAINING 30 WT-PERCENT CU [J].

OKABE, T ;

MITCHELL, R ;

WRIGHT, AH ;

FAIRHURST, CW .

JOURNAL OF DENTAL RESEARCH, 1978, 57 (7-8) :768-771

[34] THE EFFECT OF SN SEGREGATION AT GRAIN-BOUNDARY ON THE STEADY-STATE CREEP OF CU-10 WT-PERCENT-SN ALLOY [J].

GRAISS, G ;

SAAD, G ;

FAWZY, A ;

KENAWY, MA .

CZECHOSLOVAK JOURNAL OF PHYSICS, 1991, 41 (02) :149-156

[35] INFLUENCE OF DISPERSE ORDER ON S-N FATIGUE BEHAVIOR OF A CU-9 WT PERCENT AL-ALLOY [J].

VARSCHAVSKY, A .

MATERIALS SCIENCE AND ENGINEERING, 1976, 22 (02) :141-146

[36] SUPERPLASTIC BEHAVIOR OF A FINE-GRAINED 2-PHASE MG-9WT-PERCENT LI ALLOY [J].

METENIER, P ;

GONZALEZDONCEL, G ;

RUANO, OA ;

WOLFENSTINE, J ;

SHERBY, OD .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1990, 125 (02) :195-202

[37] WORKABILITY OF UNIDIRECTIONALLY SOLIDIFIED AL-8 WT-PERCENT CU ALLOY .2. HOT WORKABILITY [J].

TAHA, MA ;

ELMAHALLAWY, NA ;

ELBENAWY, TA .

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 1992, 35 (01) :71-81

[38] EFFECT OF EPSILON-PHASE DISSOLUTION ON ELECTRICAL-RESISTIVITY OF TORSIONALLY DEFORMED CU-6 WT PERCENT SN ALLOY [J].

SHINODA, R ;

FAWZY, A ;

GRAISS, G ;

SAAD, G .

SOLID STATE COMMUNICATIONS, 1992, 84 (03) :335-339

[39] OXIDATION OF 2-PHASE CO-54.86 WT-PERCENT CU ALLOY AT 700-1000-DEGREES-C [J].

VIANI, F ;

NANNI, P ;

GESMUNDO, F .

OXIDATION OF METALS, 1983, 19 (1-2) :53-76

[40] DIFFUSION INDUCED GRAIN-BOUNDARY MIGRATION (DIGM) AND LIQUID-FILM MIGRATION (LFM) IN AN AL-2.07WT-PERCENT CU ALLOY [J].

KUO, M ;

FOURNELLE, RA .

ACTA METALLURGICA ET MATERIALIA, 1991, 39 (11) :2835-2845

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