ADHESION OF ALUMINUM FILMS ON POLYIMIDE BY THE ELECTROMAGNETIC TENSILE TEST

被引：2
作者：
BARANSKI, BP
NEVIN, JH
机构：
来源：
JOURNAL OF ELECTRONIC MATERIALS | 1987年 / 16卷 / 01期
关键词：
D O I：
10.1007/BF02667789
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：39 / 43
页数：5
相关论文
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