NONDESTRUCTIVE EVALUATION OF MODEL ADHESIVE JOINTS BY PVDF PIEZOELECTRIC FILM SENSORS

被引:7
作者
TANG, B [1 ]
MOMMAERTS, J [1 ]
DUNCAN, RK [1 ]
DUKE, JC [1 ]
DILLARD, DA [1 ]
机构
[1] VIRGINIA POLYTECH INST & STATE UNIV,DEPT ENGN SCI & MECH,BLACKSBURG,VA 24061
关键词
D O I
10.1007/BF02322485
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Metallized poly(vinylidene fluoride) (PVDF) films can be etched into nondestructive evaluation (NDE) sensor devices. Since these sensors are relatively inexpensive, thin and lightweight, they can be attached permanently to adhesively bonded joints, laminated composites, and other structures to measure structural integrity. The present study has addressed techniques to design, attach, and utilize such sensors for adhesive joint and laminated composite applications. PVDF sensors have been successfully used as NDE transducers in pulse-echo, through-transmission, and acousto-ultrasonic techniques to monitor curing, and to.detect porosity and crack propagation in different model joint geometries. Feasibility of several applications has been demonstrated, although several problems remain. The potential of using these techniques for practical bonded structures is also suggested.
引用
收藏
页码:102 / 109
页数:8
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