BILEVEL THIN-FILM HYBRID CIRCUIT CONTAINING CROSSOVERS, RESISTORS, CAPACITORS,, AND INTEGRATED-CIRCUITS

被引：1
作者：
BRADY, TE [1 ]
HINDERMANN, DK [1 ]
机构：
[1] BELL TEL LABS, NAPERVILLE, IL 60540 USA
来源：
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1973年 / PHP9卷 / 03期
关键词：
D O I：
10.1109/TPHP.1973.1136722
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：181 / 185
页数：5
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