BILEVEL THIN-FILM HYBRID CIRCUIT CONTAINING CROSSOVERS, RESISTORS, CAPACITORS,, AND INTEGRATED-CIRCUITS

被引：1

作者：

BRADY, TE ^{[1
]}

HINDERMANN, DK ^{[1
]}

机构：

[1] BELL TEL LABS, NAPERVILLE, IL 60540 USA

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1973年 / PHP9卷 / 03期

关键词：

D O I：

10.1109/TPHP.1973.1136722

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：181 / 185

页数：5

共 50 条

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