THERMAL FATIGUE-STRENGTH ESTIMATION OF SOLDER JOINTS OF SURFACE MOUNT IC PACKAGES

被引：0
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作者：
KITANO, M
KAWAI, S
SHIMIZU, I
机构：
来源：
PROCEEDINGS OF THE TECHNICAL CONFERENCE : EIGHTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE | 1988年
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：373 / 383
页数：11
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