FAULTS IN THE STRUCTURE OF COPPER-SILICON ALLOYS - DISCUSSION

被引：0
|
作者：
HOFMANN, W
ZIEGLER, J
HANEMANN, H
机构：
来源：
JOURNAL OF METALS | 1950年 / 2卷 / 11期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：1358 / 1360
页数：3
相关论文
共 50 条
  • [41] MIGRATION OF (001) TILT BOUNDARIES IN DILUTE COPPER-SILICON BICRYSTALS
    ZORDAN, RD
    BAUER, CL
    JOURNAL OF METALS, 1979, 31 (12): : 33 - 33
  • [42] Effect of metallic coating on the properties of copper-silicon carbide composites
    Chmielewski, M.
    Pietrzak, K.
    Teodorczyk, M.
    Nosewicz, S.
    Jarzabek, D.
    Zybala, R.
    Bazarnik, P.
    Lewandowska, M.
    Strojny-Nedza, A.
    APPLIED SURFACE SCIENCE, 2017, 421 : 159 - 169
  • [43] ON THE STRUCTURE OF GOLD-SILVER-COPPER ALLOYS - DISCUSSION
    JETTE, ER
    BEVER, MB
    JAFFEE, RI
    GULBRANSEN, EA
    TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1949, 185 (11): : 857 - 858
  • [44] Galvanic Displaced Nickel-Silicon and Copper-Silicon Interfaces: A DFT Investigation
    Pedrazzetti, L.
    Soltani, P.
    Mezzi, A.
    Kaciulis, S.
    Nobili, L.
    Tommasini, M.
    Magagnin, L.
    ELECTROLESS DEPOSITION: PRINCIPLES AND APPLICATIONS 4: IN HONOR OF MILAN PAUNOVIC AND MORDECHAY SCHLESINGER, 2017, 75 (34): : 7 - 13
  • [45] Preparation of copper-silicon dioxide nanoparticles with chemical vapor synthesis
    Lahde, Anna
    Kokkonen, Noora
    Karttunen, Antti J.
    Jaaskelainen, Sirpa
    Tapper, Unto
    Pakkanen, Tapani A.
    Jokiniemi, Jorma
    JOURNAL OF NANOPARTICLE RESEARCH, 2011, 13 (09) : 3591 - 3598
  • [46] Study of copper-silicon junctions fabricated by selective electroless deposition
    Dhingra, S
    Arora, S
    George, PJ
    INDIAN JOURNAL OF PURE & APPLIED PHYSICS, 2004, 42 (12) : 916 - 920
  • [47] Nanophotonic resistive switch based on tapered copper-silicon structure with low power and high extinction ratio
    Mishra, Rahul Dev
    Pandey, Suresh Kumar
    Babu, Prem
    Kumar, Santosh
    Kumar, Ashutosh
    Mohanta, Nikita
    Kumar, Mukesh
    OPTICS AND LASER TECHNOLOGY, 2024, 175
  • [48] Studies upon the Widmanstatten structure, I - Introduction the aluminum-silver system and the copper-silicon system
    Mehl, RF
    Barrett, CS
    TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1931, 93 : 78 - 122
  • [49] Copper-silicon carbide composite plating for inhibiting the extrusion of through silicon via (TSV)
    Kee, Se-Ho
    Kim, Won-Joong
    Jung, Jae-Pil
    MICROELECTRONIC ENGINEERING, 2019, 214 : 5 - 14
  • [50] The alpha solubility limit and the first lntermediary phase in the copper-silicon system
    Andersen, AGH
    TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1940, 137 : 334 - 350
12345