WETTABILITY OF HOT-PRESSED SIC BY LIQUID CU-TI ALLOY

被引：2

作者：

NOGI, K

IKEDA, K

OGINO, K

机构：

[1] Osaka Univ, Suita

来源：

JOURNAL OF THE JAPAN INSTITUTE OF METALS | 1990年 / 54卷 / 12期

关键词：

SINTERING; SIC; WETTABILITY; COPPER-TITANIUM ALLOY; CONTACT ANGLE;

D O I：

10.2320/jinstmet1952.54.12_1401

中图分类号：

学科分类号：

摘要：

The wettability of hot-pressed SiC, which had been made in present work, by liquid Cu-Ti alloy was investigated at 1393 K under reduced pressure. The main results are summerized as follows: (1) The wettability of SiC by liquid Cu-Ti alloy was improved by a small amount of Ti. (2) A formation of TiC was observed at the initial interface between liquid Cu-Ti alloy and SiC. (3) The improvement of the wettability was not attained by the formation of TiC but by the dissolution of Si and C into liquid Cu.

引用

页码：1401 / 1407

页数：7

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