EPITAXIAL SILICON DEPOSITION AT 300-DEGREES-C WITH REMOTE PLASMA PROCESSING USING SIH4/H2 MIXTURES

被引:25
作者
HATTANGADY, SV
POSTHILL, JB
FOUNTAIN, GG
RUDDER, RA
MANTINI, MJ
MARKUNAS, RJ
机构
关键词
D O I
10.1063/1.105589
中图分类号
O59 [应用物理学];
学科分类号
摘要
Epitaxial Si films have been deposited on Si(100) at 300-degrees-C by remote plasma-enhanced chemical vapor deposition using SiH4/H-2 mixtures With deposition rates as high as 25 angstrom/min at these low temperatures. Hall measurements of the film show an unintentional doping level of about 1 X 10(17) cm-3 With electron mobilities of 700 cm2 V-1 s-1. Critical to the process is the in situ cleaning of the silicon substrate surface prior to deposition.
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页码:339 / 341
页数:3
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