A MICROCOMPUTER PROGRAM FOR STRESS-ANALYSIS OF ADHESIVE-BONDED JOINTS

被引：10

作者：

AMIJIMA, S

FUJII, T

机构：

[1] Doshisha Univ, Jpn, Doshisha Univ, Jpn

来源：

INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES | 1987年 / 7卷 / 04期

关键词：

COMPUTER SOFTWARE - MATHEMATICAL TECHNIQUES - Finite Element Method - STRESSES - Analysis;

D O I：

10.1016/0143-7496(87)90023-6

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

This paper presents the equations used in a stress analysis program for adhesive-bonded joints which is based on the finite element method and is written in BASIC for HP-9000 series computers. Thermal expansion of both the adherends and the adhesive layer is considered.

引用

页码：199 / 204

页数：6