DISCONTINUOUS STRUCTURE REACTIONS DURING SOLUTION TREATMENT OF COPPER-SILVER ALLOYS

被引:0
|
作者
SCHARFENBERGER, W
SCHUTRUM.A
BORCHERS, H
机构
来源
METALL | 1969年 / 23卷 / 11期
关键词
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
引用
收藏
页码:1126 / +
页数:1
相关论文
共 50 条
  • [31] Novel process of electrochemical separation of copper-silver alloys in sulfate electrolyte
    Koshel, N.D., 2000, Akademiya Nauk Moldavskoi S.S.R.
  • [32] Quantitative X-ray analysis - Copper-silver and copper-zinc alloys
    Terrey, H
    Barrett, EGV
    JOURNAL OF PHYSICAL CHEMISTRY, 1931, 35 (04): : 1156 - 1167
  • [33] CLIMB OF ALPHA/2(110) DISLOCATONS ASSOCIATED WITH DISCONTINUOUS PRECIPITATION IN A COPPER-SILVER ALLOY
    MIEKKOJA, HM
    RATY, R
    PHILOSOPHICAL MAGAZINE, 1971, 24 (191): : 1197 - &
  • [34] On the mechanical and electrical properties of copper-silver and copper-silver-zirconium alloys deposits manufactured by cold spray
    Coddet, Pierre
    Verdy, Christophe
    Coddet, Christian
    Debray, Francois
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2016, 662 : 72 - 79
  • [35] Studies upon the widmanstatten structure, VII - The copper-silver system
    Barrett, CS
    Kaiser, HF
    Mehl, RF
    TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1935, 117 : 39 - 57
  • [37] Implications of Surface Strain for Enhanced Carbon Dioxide Reduction on Copper-Silver Alloys
    Hailu, Amanuel
    Shaw, Scott K.
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2020, 167 (12)
  • [38] DEVELOPMENT OF HIGH-STRENGTH, HIGH-CONDUCTIVE COPPER-SILVER ALLOYS
    SAKAI, Y
    INOUE, K
    ASANO, T
    MAEDA, H
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1991, 55 (12) : 1382 - 1391
  • [39] Modelling of nodular particle growth in a liquid-solid film during condensation experiments of copper-silver alloys
    Leroux, S
    Le Ny, J
    Guéneau, C
    Goldstein, S
    Camel, D
    EUROPEAN PHYSICAL JOURNAL-APPLIED PHYSICS, 2001, 15 (01): : 7 - 13
  • [40] Effect of silver addition in copper-silver alloys fabricated by laser powder bed fusion in situ alloying
    Robinson, John
    Arjunan, Arun
    Stanford, Mark
    Lyall, Iain
    Williams, Craig
    JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 857