HYBRID CIRCUITS - THICK FILM ENGINEERING

被引：0
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作者：
DELFS, H
机构：
来源：
INTERNATIONALE ELEKTRONISCHE RUNDSCHAU | 1971年 / 25卷 / 07期
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：175 / &
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