SOLDER JOINT FATIGUE IN SURFACE MOUNT TECHNOLOGY - STATE OF THE ART

被引:0
|
作者
LAU, JH
RICE, DW
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:91 / 104
页数:14
相关论文
共 50 条
  • [31] Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components
    Ab Rahman, Mohd Nizam
    Zubir, Noor Suhana Mohd
    Leuveano, Raden Achmad Chairdino
    Ghani, Jaharah A.
    Mahmood, Wan Mohd Faizal Wan
    MATERIALS, 2014, 7 (12) : 7706 - 7721
  • [32] AUTOMATED VISUAL INSPECTION OF SOLDER PASTE DEPOSITION ON SURFACE MOUNT TECHNOLOGY PCBS
    MAHON, J
    HARRIS, N
    VERNON, D
    COMPUTERS IN INDUSTRY, 1989, 12 (01) : 31 - 42
  • [33] A study of the strength and shape of surface mount technology leadless chip solder joints
    Hui, IK
    Ralph, B
    PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE, 1997, 211 (01) : 29 - 41
  • [34] Studies on underfilling components with area array solder terminals in surface mount technology
    Schaefer, H
    Maurieschat, U
    Schimanski, H
    Poech, MH
    Hoefer, E
    Harder, T
    2004 4TH IEEE INTERNATIONAL CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, 2004, : 153 - 162
  • [35] Orthogonal fuzzy model of the solder paste printing stage of surface mount technology
    Lotfi, A
    Howarth, M
    Thomas, PD
    PROCEEDINGS OF THE SIXTH IEEE INTERNATIONAL CONFERENCE ON FUZZY SYSTEMS, VOLS I - III, 1997, : 1433 - 1437
  • [36] Study of the strength and shape of surface mount technology leadless chip solder joints
    Hui, I.K.
    Ralph, B.
    Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 1997, 211 (B1): : 29 - 41
  • [37] THERMAL FATIGUE-STRENGTH ESTIMATION OF SOLDER JOINTS OF SURFACE MOUNT IC PACKAGES
    KITANO, M
    KAWAI, S
    SHIMIZU, I
    PROCEEDINGS OF THE TECHNICAL CONFERENCE : EIGHTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, 1988, : 373 - 383
  • [38] Influence of Surface Mount Solder Joint Height during the Thermo-Mechanical Analysis
    Tan, J. S.
    Khor, C. Y.
    Lau, Chun-Sean
    Ani, F. Che
    Tan, W. H.
    Chuah, H. G.
    GREEN DESIGN AND MANUFACTURE: ADVANCED AND EMERGING APPLICATIONS, 2018, 2030
  • [39] A Fuzzy Method for Global Quality Index Evaluation of Solder Joints in Surface Mount Technology
    Acciani, Giuseppe
    Fornarelli, Girolamo
    Giaquinto, Antonio
    IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS, 2011, 7 (01) : 115 - 124
  • [40] Evaluation of fatigue crack initiation and extension life in microelectronics solder joints of surface mount type
    Kaminishi, K
    Iino, M
    Taneda, M
    JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, 1999, 42 (02): : 272 - 279