SILICON LOSS AND TRANSIENT ETCH RATE IN SELECTIVE REACTIVE ION ETCHING OF OXIDE OVERLAYERS

被引:6
|
作者
OEHRLEIN, GS
KALISH, R
机构
[1] TECHNION ISRAEL INST TECHNOL,DEPT PHYS,HAIFA,ISRAEL
[2] TECHNION ISRAEL INST TECHNOL,INST SOLID STATE,HAIFA,ISRAEL
关键词
D O I
10.1063/1.100673
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
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页码:2698 / 2700
页数:3
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