EFFECTS OF CURE TEMPERATURE ON EPOXY-RESIN PROPERTIES

被引：16

作者：

SINCLAIR, JW

机构：

[1] Thiokol Corporation, Brigham City

来源：

JOURNAL OF ADHESION | 1992年 / 38卷 / 3-4期

关键词：

EFFECTS OF CURE TEMPERATURE; FTIR CURE KINETICS; KINETIC RATE LAW; UNDERCURED GLASSED ADHESIVES; DYNAMIC MECHANICAL PROPERTIES OF UNDERCURED ADHESIVES; TEMPERATURE-ADHESIVE TENSILE STRENGTH BEHAVIOR;

D O I：

10.1080/00218469208030456

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

An experimental study was undertaken to determine the effects of incomplete resin cure on the dynamic moduli and tensile strengths of two commercial amine-cured epoxy adhesives. Depending on the value of T(g infinity) - T(cure), a resin may glass before complete cross-linking occurs leaving the system in a nearly-stable undercured state. The level of unreacted epoxy in the glass state was determined by FTIR, and the effects on dynamic mechanical properties and tensile bond strengths measured.

引用

页码：219 / 234

页数：16

共 28 条

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