ROLE OF THE INTERFACIAL THERMAL BARRIER IN THE EFFECTIVE THERMAL-DIFFUSIVITY CONDUCTIVITY OF SIC-FIBER-REINFORCED REACTION-BONDED SILICON-NITRIDE

被引：75

作者：

BHATT, H ^{[1
]}

DONALDSON, KY ^{[1
]}

HASSELMAN, DPH ^{[1
]}

BHATT, RT ^{[1
]}

机构：

[1] NASA,DIV MAT,CERAM BRANCH,CLEVELAND,OH 44135

来源：

JOURNAL OF THE AMERICAN CERAMIC SOCIETY | 1990年 / 73卷 / 02期

关键词：

composites; silicon carbide; silicon nitride; thermal conductivity; thermal resistance;

D O I：

10.1111/j.1151-2916.1990.tb06511.x

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Experimental thermal diffusivity data transverse to the fiber direction for composites composed of a reaction bonded silicon nitride matrix reinforced with uniaxially aligned carbon‐coated silicon carbide fibers indicate the existence of a significant thermal barrier at the matrix‐fiber interface. Calculations of the interfacial thermal conductances indicate that at 300°C and 1‐atm N2, more than 90% of the heat conduction across the interface occurs by gaseous conduction. The magnitude of the interfacial conductance is decreased significantly under vacuum or by removal of the carbon surface layer from the fibers by selective oxidation. Good agreement is obtained between thermal conductance values for the oxidized composite at 1 atm calculated from the thermal conductivity of the N2 gas and those inferred from the data for the effective composite thermal conductivity. Copyright © 1990, Wiley Blackwell. All rights reserved

引用

页码：312 / 316

页数：5

共 33 条

[1]

[Anonymous], 1892, PHILOS MAG

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