UNDERCUTTING PHENOMENA IN AL PLASMA-ETCHING

被引:14
作者
ODA, M
HIRATA, K
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D O I
10.1143/JJAP.19.L405
中图分类号
O59 [应用物理学];
学科分类号
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页码:L405 / L408
页数:4
相关论文
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[5]   REACTIVE ION ETCHING OF ALUMINUM AND ALUMINUM-ALLOYS IN AN RF PLASMA CONTAINING HALOGEN SPECIES [J].
SCHAIBLE, PM ;
METZGER, WC ;
ANDERSON, JP .
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[6]   ANALYSIS OF IMAGING ACCURACY IN REACTIVE ION ETCHING [J].
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