FLIP-FLOP THIN-FILM DESIGN PROGRAM WITH ENHANCED CAPABILITIES

A flip-flop thin-film design program has been written that makes possible the incorporation of metallic films in the resulting multilayer coatings. This is done by allowing the selection process to choose from three different dispersive materials, one of which may be absorbing. Provision is also made to apply the flip-flop procedure to only part of the layer system. A more elaborate specification of the desired performance is now possible. These changes greatly increase the types of problem that may be solved by using this technique. The method is demonstrated on a number of different problems.