ELASTIC PROPERTIES AND THERMAL-EXPANSION OF MONOCLINIC HFO2

被引:0
作者
DOLE, SL [1 ]
HUNTER, O [1 ]
CALDERWOOD, FW [1 ]
机构
[1] IOWA STATE UNIV,AMES,IA 50011
来源
AMERICAN CERAMIC SOCIETY BULLETIN | 1977年 / 56卷 / 03期
关键词
D O I
暂无
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:296 / 296
页数:1
相关论文
共 50 条
[21]   SIMS study of oxygen diffusion in monoclinic HfO2 [J].
Mueller, Michael P. ;
De Souza, Roger A. .
APPLIED PHYSICS LETTERS, 2018, 112 (05)
[22]   THERMAL-EXPANSION AND ELASTIC PROPERTIES OF NB-MO ALLOYS [J].
DECAMARGO, PC ;
BROTZEN, FR ;
STEINEMANN, S .
JOURNAL OF PHYSICS F-METAL PHYSICS, 1987, 17 (05) :1065-1079
[23]   THERMAL-EXPANSION IN SYSTEM Y2O3-HFO2 [J].
STACY, DW ;
WILDER, DR .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1973, 56 (04) :224-224
[24]   INVAR AND ELINVAR - ALLOYS WITH CONTROLLABLE THERMAL-EXPANSION AND ELASTIC PROPERTIES [J].
HAUSCH, G ;
WARLIMONT, H .
ZEITSCHRIFT FUR METALLKUNDE, 1973, 64 (03) :152-160
[25]   HYDROTHERMAL REACTION-SINTERING OF MONOCLINIC HFO2 [J].
TORAYA, H ;
YOSHIMURA, M ;
SOMIYA, S .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1982, 65 (09) :C159-C160
[26]   Theoretical analysis of oxygen diffusion in monoclinic HfO2 [J].
Ikeda, M ;
Kresse, MIG ;
Nabatame, T ;
Toriumi, A .
FUNDAMENTALS OF NOVEL OXIDE/SEMICONDUCTOR INTERFACES, 2004, 786 :17-+
[27]   ELASTIC PROPERTIES OF PARTIALLY-STABILIZED HFO2 COMPOSITIONS [J].
SCHEIDECKER, RW ;
HUNTER, O ;
CALDERWOOD, FW .
JOURNAL OF MATERIALS SCIENCE, 1979, 14 (10) :2284-2288
[28]   THERMAL-EXPANSION AND ELASTIC-CONSTANTS [J].
LEDBETTER, H .
INTERNATIONAL JOURNAL OF THERMOPHYSICS, 1991, 12 (04) :637-642
[29]   Effects of substrate temperature on properties of HfO2, HfO2:Al and HfO2:W films [J].
Lin, Su-Shia ;
Liao, Chung-Sheng ;
Fan, Sheng-You .
SURFACE & COATINGS TECHNOLOGY, 2015, 271 :269-275
[30]   Structural, electronic, optical, elastic properties and Born effective charges of monoclinic HfO2 from first-principles calculations [J].
Liu Qi-Jun ;
Zhang Ning-Chao ;
Liu Fu-Sheng ;
Liu Zheng-Tang .
CHINESE PHYSICS B, 2014, 23 (04)