ALGORITHMS FOR COUPLED TRANSIENT SIMULATION OF CIRCUITS AND COMPLICATED 3-D PACKAGING

被引：9

作者：

SILVEIRA, LM

KAMON, M

WHITE, J

机构：

[1] Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1995年 / 18卷 / 01期

关键词：

INTERCONNECT; PACKAGING; SIMULATION; MULTIPOLE; BALANCED REALIZATION; RECURSIVE CONVOLUTION;

D O I：

10.1109/96.365494

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Techniques are described for coupled simulation of complicated 3-D interconnect and nonlinear transistor drivers and receivers. The approach is based on combining: multipole-accelerated method-of-moments techniques for extracting frequency-dependent inductances and resistances for the interconnect; a sectioning method for fitting the frequency-domain data with a rational function; a balanced-realization approach to reducing the order of the rational function in a guaranteed stable manner; and an implementation of fast recursive convolution to incorporate the rational function in SPICE3. Results are presented to demonstrate some of the frequency-dependent effects in a packaging analysis problem.

引用

页码：92 / 98

页数：7

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