INTERMETALLIC COMPOUNDS AT ALUMINUM-TO-COPPER ELECTRICAL INTERFACES - EFFECT OF TEMPERATURE AND ELECTRIC-CURRENT

被引：122

作者：

BRAUNOVIC, M

ALEXANDROV, N

机构：

[1] IREQ, Institut de recherche d'Hydro-Québec, Varennes, P.Q.

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1994年 / 17卷 / 01期

关键词：

D O I：

10.1109/95.296372

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effects of intermetallic compounds on the electrical and mechanical properties of bimetallic friction welded Al-Cu joints was studied. The formation and growth of intermetallic compounds was studied in the temperature ranges 200-525-degrees-C. In addition, the effect of electrical current on the morphology and kinetics of formation of intermetallic compounds of bimetallic friction welded aluminum-copper joints was studied in the temperature ranges 200-500-degrees-C that was realized by heating Al-Cu joints with an ac current of different intensities (400-1000 A). The contact resistance was found to increase linearly with the thickness of the intermetallics. The presence of an electrical field greatly accelerates the kinetics of formation of intermetallic phases and alters significantly their morphology. The growth kinetics of intermetallic phases under the influence of electrical current is much higher than that under diffusion annealing in furnace.

引用

页码：78 / 85

页数：8