Correction force for releasing crack tip element with XFEM and only discontinuous enrichment How to smoothly release the crack tip element with only discontinuous enrichment in XFEM?

被引:8
作者
Menouillard, Thomas [1 ]
Belytschko, Ted [1 ]
机构
[1] Northwestern Univ, Theoret & Appl Mech, 2145 Sheridan Rd, Evanston, IL 60208 USA
来源
EUROPEAN JOURNAL OF COMPUTATIONAL MECHANICS | 2009年 / 18卷 / 5-6期
关键词
XFEM; cohesive law; discontinuous enrichment; Heaviside function; dynamic crack propagation;
D O I
10.3166/EJCM.18.465-483
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
This paper deals with numerical crack propagation and makes use of the extended finite element method in the case of explicit dynamics. The advantage of this method is the absence of remeshing. The use of XFEM with Heaviside functions only gives a binary description of the crack tip element: cut or not. Here, we modify the internal forces with a correction force in order to smoothly release the tip element while the virtual crack tip travels through an element. This avoids creating non physical stress waves and improves the accuracy of the evaluation of the stress intensity factors during propagation.
引用
收藏
页码:465 / 483
页数:19
相关论文
共 36 条
[1]  
Barenblatt G.I., 1962, ADV APPL, V7, P55, DOI DOI 10.1016/S0065-2156(08
[2]  
Belytschko T, 1999, INT J NUMER METH ENG, V45, P601, DOI 10.1002/(SICI)1097-0207(19990620)45:5<601::AID-NME598>3.0.CO
[3]  
2-S
[4]  
Belytschko T, 2001, INT J NUMER METH ENG, V50, P993, DOI 10.1002/1097-0207(20010210)50:4<993::AID-NME164>3.0.CO
[5]  
2-M
[6]  
Belytschko T., 2000, NONLINEAR FINITE ELE
[8]  
Bui H, 1978, MECANIQUE RUPTURE FR
[9]   X-FEM a good candidate for energy conservation in simulation of brittle dynamic crack propagation [J].
Combescure, A. ;
Gravouil, A. ;
Gregoire, D. ;
Rethore, J. .
COMPUTER METHODS IN APPLIED MECHANICS AND ENGINEERING, 2008, 197 (05) :309-318
[10]   An extended finite element method for modeling crack growth with frictional contact [J].
Dolbow, J ;
Moës, N ;
Belytschko, T .
COMPUTER METHODS IN APPLIED MECHANICS AND ENGINEERING, 2001, 190 (51-52) :6825-6846