EFFECT OF SOME FACTORS ON ELECTRODEPOSITION OF NICKEL-COPPER ALLOY FROM PYROPHOSPHATE-TETRABORATE BATH

被引：44
作者：
ISHIKAWA, M
ENOMOTO, H
MATSUOKA, M
IWAKURA, C
机构：
[1] RITSUMEIKAN UNIV,SHIGA 525,JAPAN
[2] UNIV OSAKA PREFECTURE,SAKAI,OSAKA 593,JAPAN
来源：
ELECTROCHIMICA ACTA | 1995年 / 40卷 / 11期
关键词：
ELECTRODEPOSITION; NICKEL COPPER ALLOY; PYROPHOSPHATE TETRABORATE BATH;
D O I：
10.1016/0013-4686(95)00084-R
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Effects of bath compositions and operating conditions on the electrodeposition of nickel-copper alloy from a pyrophosphate-tetraborate bath have been studied. The composition of nickel-copper alloy was influenced by pyrophosphate concentration, pH of the bath, metal ion ratio and citrate ions in the bath. Pyrophosphate ions facilitate the codeposition of nickel and copper, but their excess inhibits the nickel deposition. The nickel deposition was also inhibited by increasing the concentration of copper and citrate ions.
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页码：1663 / 1668
页数：6
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