MHDL - BRIDGING THE DESIGN AND COMMUNICATION GAP

被引:0
作者
CARMICHAEL, L
PERLMAN, B
RHODES, D
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A common, high level means to describe component and system behavior, define specifications and exchange data is needed to complement the microwave/mm-wave monolithic integrated circuits (MMIC) program. A new DARPA funded Phase 3 effort is underway to develop a MMIC hardware description language (MHDL) to satisfy this need. The development of MHDL is key to establishing microwave analog hardware specification and description capabilities that complement the digitally-oriented VHSIC hardware description language (VHDL).
引用
收藏
页码:76 / &
相关论文
共 1 条
  • [1] 1991, ELECTRONIC ENG 0204