INTERFACING METHODS OF THE THERMOCOUPLES IN APPLICATIONS WITH THE MICROCONTROLLER

被引:0
作者
Stan, O. [1 ]
Mihoc, D. [1 ]
机构
[1] Univ Politehn Bucuresti, Dept Automat & Comp, Bucharest, Romania
来源
UNIVERSITY POLITEHNICA OF BUCHAREST SCIENTIFIC BULLETIN SERIES C-ELECTRICAL ENGINEERING AND COMPUTER SCIENCE | 2007年 / 69卷 / 03期
关键词
Electromotive force (EMF); Seebeck coefficient; Resistive Temperature Detector (RTD);
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This article deals with the interfacing modalities of the temperature sensor at the IN/OUT ports of a flash microcontroller from the PIC Microchip family but also, there are being presented and analysed some of the compensation hardware methods of the cold terminal junction, the measurement corrections, the dependence of the route (amplifier to the minimal perceptible level) of the useful compensated signal with a view to its application to the input Analog-Digital converter enclosed in microcontroller. By all means, the purpose of the application, the range of the measured temperature (the temperature variation) determine the choice of the most appropriated compensation methods as well as the optimal type of thermocouple or another sensor type which must be used in order to obtain a good precision of the measuring results. In the author's opinion represent an original contribution, the determination and analysis the main types of the mathematical equations at the level of the AD converter enclosed in the microcontroller in order, to release the optimal resolution conversion and the interfacing methods.
引用
收藏
页码:159 / 168
页数:10
相关论文
共 3 条
  • [1] Dallas Semiconductor, DALL SEM APP NOT
  • [2] Kester Walt, TEMPERATURE SENSORS
  • [3] Microchip Tehnology, MICR TECHN APP NOT