CHARACTERISTICS OF JOSEPHSON JUNCTIONS USING THE CRACK IN YBCO THIN FILMS

被引：1

作者：

Kimura, H. ^{[1
]}

Miyazaki, M. ^{[1
]}

Tsuda, K. ^{[2
]}

Okabe, Y. ^{[1
]}

机构：

[1] Univ Tokyo, Res Ctr Adv Sci & Technol, Meguro Ku, 4-6-1 Komaba, Tokyo 153, Japan

[2] Fuji Elect Corp Res & Dev Ltd, 2-2-1 Nagasaka, Yokosuka, Kanagawa 24001, Japan

来源：

IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 1993年 / 3卷 / 01期

关键词：

D O I：

10.1109/77.233415

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We studied (013) oriented YBa2Cu3Ox (YBCO) thin films on SrTiO3(110) substrates. Although the surfaces of the films were smooth enough, there were parallel and straight cracks in the films more than 150nm thick. These cracks were caused by the c-axis shrinkage associated with the tetragonal-to-orthoronbic phase transition during the cooling process. We tried to fabricate Josephson devices using these cracks, In order to control the electrical properties of the crack junctions, thickness of the films was studied. We considered the fabricated devices to be typical microbridges.

引用

页码：2413 / 2416

页数：4

共 6 条

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