DELAYED ACTION PRESSURE-SENSITIVE ADHESIVES - CORRELATION OF DIELECTRIC AND MECHANICAL-PROPERTIES

The dielectric relaxation spectra measured over a frequency range from 10(-1) to 10(5) HZ and over a temperature range from 245 to 350K are reported for two delayed action heat seal adhesives. Measurements of the peel strength were made over a temperature range from 225 to 313K at two peel rates, 40 and 200 mm min-1. A correlation was observed between the magnitude of the dielectric loss and the peel strength for these adhesives, indicating the role of polymer motion in determining the adhesive strength. The importance of these observations, both in the context of the fundamental understanding of the peel process and in the design of new adhesive systems, is discussed.