Design of a 3D Wilkinson power divider using through glass via technology

被引：1

作者：

Sang, Jifei ^{[1
]}

Qian, Libo ^{[1
]}

Xia, Yinshui ^{[1
]}

Xia, Huakang ^{[1
]}

机构：

[1] Ningbo Univ, Fac Elect Engn & Comp Sci, Ningbo 315211, Zhejiang, Peoples R China

来源：

JOURNAL OF SEMICONDUCTORS | 2018年 / 39卷 / 12期

基金：

中国国家自然科学基金;

关键词：

3D integration; glass interposer; through glass vias; power divider;

D O I：

10.1088/1674-4926/39/12/125007

中图分类号：

O469 [凝聚态物理学];

学科分类号：

070205 ;

摘要：

Due to its low electrical loss and low process cost, a glass interposer has been developed to provide a compelling alternative to the silicon-based interposer for packaging of future 2-D and 3-D ICs. In this study, through glass vias (TGVs) are used to implement 3-D inductors for minimal footprint and large quality factor. Using the inductors and parallel plate capacitors, a compact 3-D Wilkinson power divider is designed and analyzed. Compared with some reported power dividers, the proposed TGV-based circuit has an ultra-compact size and excellent electrical performance.

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页数：4

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