EFFECT OF CERTAIN IONS ON THE INTERNAL-STRESS OF BRIGHT COPPER ELECTRODEPOSITS

The effect of low concentrations (0-100 mg 1-1) of F, Cl, Br, I, As, Sb, Bi, Ni, Zn, Fe, Ag, Te, Se, Pb, and S on the internal stress of bright copper electrodeposits was studied. The following solution containing 30 mg 1-1 of thiourea as a brightening additive was used as the electrolyte: CuSO4·5H2O (225 g l-1), H2SO4 (60g l-1). It is shown that the internal stress of copper electrodeposits can be considerably reduced by addition of Se(IV), Cl, Br, or I to the above electrolyte. © 1979 Chapman and Hall Ltd.