EFFECT OF RESIDUAL GASES ON SURFACE-MORPHOLOGY AND MICROSTRUCTURE OF PB-IN-AU FILMS DEPOSITED AT 95-K

被引：5
作者：
HUANG, HCW
BAKER, JM
SERRANO, CM
KIRCHER, CJ
机构：
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1981年 / 19卷 / 01期
关键词：
Compendex;
D O I：
10.1116/1.571019
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
LEAD INDIUM GOLD ALLOYS
引用
收藏
页码：72 / 79
页数：8
相关论文
共 8 条
  • [1] OVERVIEW OF MATERIALS AND PROCESS ASPECTS OF JOSEPHSON INTEGRATED-CIRCUIT FABRICATION
    AMES, I
    [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1980, 24 (02) : 188 - 194
  • [2] CONDENSATION COEFFICIENT MEASUREMENTS OF H2O, N2O, AND CO2
    BRYSON, CE
    CAZCARRA, V
    LEVENSON, LL
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (01): : 411 - 416
  • [3] FABRICATION PROCESS FOR JOSEPHSON INTEGRATED-CIRCUITS
    GREINER, JH
    KIRCHER, CJ
    KLEPNER, SP
    LAHIRI, SK
    WARNECKE, AJ
    BASAVAIAH, S
    YEN, ET
    BAKER, JM
    BROSIOUS, PR
    HUANG, HCW
    MURAKAMI, M
    AMES, I
    [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1980, 24 (02) : 195 - 205
  • [4] HONIG PE, 1960, RCA REV, V21, P360
  • [5] HIGH-RELIABILITY PB-ALLOY JOSEPHSON-JUNCTIONS FOR INTEGRATED-CIRCUITS
    HUANG, HCW
    BASAVAIAH, S
    KIRCHER, CJ
    HARRIS, EP
    MURAKAMI, M
    KLEPNER, SP
    GREINER, JH
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1980, 27 (10) : 1979 - 1987
  • [6] METALLURGICAL CONSIDERATIONS WITH RESPECT TO ELECTRODES AND INTERCONNECTION LINES FOR JOSEPHSON TUNNELING CIRCUITS
    LAHIRI, SK
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (01): : 148 - 151
  • [7] THERMAL-STABILITY OF PB-ALLOY JOSEPHSON JUNCTION ELECTRODE MATERIALS .1. EFFECTS OF FILM THICKNESS AND GRAIN-SIZE OF PB-IN-AU BASE ELECTRODES
    MURAKAMI, M
    [J]. JOURNAL OF APPLIED PHYSICS, 1981, 52 (03) : 1309 - 1319
  • [8] THERMAL STRAIN IN THIN LEAD FILMS .3. DEPENDENCES OF THE STRAIN ON FILM THICKNESS AND ON GRAIN-SIZE
    MURAKAMI, M
    [J]. THIN SOLID FILMS, 1979, 59 (01) : 105 - 116
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