EFFECT OF CATHODE MATERIALS ON REACTIVE ION ETCHING OF SILICON AND SILICON DIOXIDE IN A CF4 PLASMA

被引:25
作者
EPHRATH, LM
机构
关键词
D O I
10.1007/BF02655646
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:415 / 428
页数:14
相关论文
共 11 条
[1]  
ABE H, 1975, J JAPAN SOC APPL PHY, V44, P289
[2]   DRY PROCESS TECHNOLOGY (REACTIVE ION ETCHING) [J].
BONDUR, JA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (05) :1023-1029
[3]  
BURG AB, 1950, FLURORINE CHEMISTRY, V1
[4]  
CHOU N, 1976, COMMUNICATION
[5]   CONTROL OF RELATIVE ETCH RATES OF SIO2 AND SI IN PLASMA ETCHING [J].
HEINECKE, RAH .
SOLID-STATE ELECTRONICS, 1975, 18 (12) :1146-1147
[6]  
KELLER J, 1975, KODAK MICROELECTRONI
[7]  
KIRK RW, 1974, TECHNIQUES APPLICATI, P357
[8]  
KUMAR R, 1975, IEDM TECH DIGEST, P27
[9]  
SCHWARTZ G, 1975, COMMUNICATION
[10]  
SCHWARTZ GC, 1976, ETCHING, P122