DIRECT BONDING IN PATENT LITERATURE

被引：1

作者：

HAISM, J

机构：

[1] Philips Research Laboratories, 5656 AA Eindhoven

来源：

PHILIPS JOURNAL OF RESEARCH | 1995年 / 49卷 / 1-2期

关键词：

DIRECT BONDING; PATENT LITERATURE;

D O I：

10.1016/0165-5817(95)82009-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Patent literature tells its own story of technological innovations. This story is evaluated here in the case of direct bonding. It is concluded that, on a worldwide basis, direct bonding has been approached via three avenues: optical, silicon technology and silicon wafer preparation.

引用

页码：165 / 170

页数：6